eta/DYNAFORM is the most accurate die analysis solution available today. Its formability simulation creates a "virtual tryout", predicting forming problems such as cracking, wrinkling, thinning and spring-back before any physical tooling is produced. Integrated into DYNAFORM is the analysis engine, LS-DYNA, which is capable of implicit and explicit solutions for a complete and accurate forming analysis.
Complete Die System Simulation Solution
DYNAFORM is the complete die system simulation solution. DYNAFORM allows the organization to entirely bypass soft tooling, reducing overall tryout time, lowering costs, increasing productivity and providing complete confidence in die system design. It also allows evaluation of alternative and unconventional designs and materials for an optimal solution. The most cost-effective and accurate solution available, DYNAFORM is the clear choice among progressive organizations seeking to streamline the die analysis system.
One Simple Interface
DYNAFORM encompasses the entire die system process in one simple interface. By simulating every detail during the design stage, DYNAFORM ensures the highest quality formed part and best manufacturing process. The system guides the engineer through cost estimation, quoting, die face design and formability analysis. Then, in a virtual environment, moves the part through the stamping process inside the plant—station by station. DYNAFORM simulates trimming/shedding and scrap removal and analyzes die structural integrity. Finally, DYNAFORM evaluates the part transfer process within the die system and simulates the behavior of the part during shipping.
A Solid Infrastructure
DYNAFORM offers NURBS based CAD surfaces capability.This allows DYNAFORM’s mesh-based technology to maintain full parametric associativity throughout the entire simulation process. LS-DYNA , the most powerful solver in its class, is the engine within DYNAFORM.Offering tremendous calculation power to support difficult modeling and simulation challenges within a die system, these powerful processing and solving technologies enable DYNAFORM to meet the needs of users today and those in the future.
The Most Accurate & Cost-Effective Solution
The clear price/performance leader in the industry, DYNAFORM offers pin-point accuracy in every detail and is the key reason die designers all over the world have turned to DYNAFORM for the most precise analysis possible.
DYNAFORM is delivered in 4 Modules:
BSE Blank Size Engineering
The BSE module is a complete solution for accurate blank size estimation, nesting to maximize material utilization, piece price and scrap calculation. BSE is based on a one-step algorithm for rapid calculation. Potential forming failure due to excessive blank thinning is detected through an inverse method.BSE also creates a forming limit diagram (FLD) map for feasibility review.
DFE Die Face Engineering
Based on the product design of a panel, the DFE module offers capabilities of both CAD surface and CAE meshing tools.DFE Interactively generates binder surfaces, addendum profiles/surfaces, PO Lines and layout drawbeads with full associativity between FEA mesh and surfaces. A preliminary die face is created for further formability studies with an iterative process until die face validation is achieved.
FS Formability Simulation
The FS module is a complete incremental die simulation program for quickly generating formability results at a very early stage of the product design cycle. It is suited for design feasibility analysis and verification. Stress, strain and thickening results are plotted and a complete forming limit diagram (FLD) is generated. It is a proven tool for uncovering hidden problem areas.
DSA Die System Analysis
DSA offers an LS-DYNA based FEA solution to analyze die system operations including scrap shedding/removal, die structural integrity and sheet metal transferring/handling. Further development will include trimming, flanging and hemming operations.
For further information please visit the eta/DYNAFORM website at www.dynaform.com
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